On the Nanostructure of Cu in TixCu1-x and TiN/Cu Films: a XAFS Study
| dc.contributor.author | Pinakidou, F. | en |
| dc.contributor.author | Katsikini, M. | en |
| dc.contributor.author | Patsalas, P. | en |
| dc.contributor.author | Abadias, G. | en |
| dc.contributor.author | Paloura, E. C. | en |
| dc.date.accessioned | 2015-11-24T17:36:50Z | |
| dc.date.available | 2015-11-24T17:36:50Z | |
| dc.identifier.issn | 1662-5250 | - |
| dc.identifier.uri | https://olympias.lib.uoi.gr/jspui/handle/123456789/14289 | |
| dc.rights | Default Licence | - |
| dc.subject | exafs | en |
| dc.subject | nexafs | en |
| dc.subject | short-range order | en |
| dc.subject | tin-coatings | en |
| dc.subject | ticu films | en |
| dc.subject | x-ray-absorption | en |
| dc.subject | superhard nanocomposite coatings | en |
| dc.subject | thin-films | en |
| dc.subject | mechanical-properties | en |
| dc.subject | edge spectroscopy | en |
| dc.subject | fine-structure | en |
| dc.subject | copper | en |
| dc.subject | superconductors | en |
| dc.subject | oxidase | en |
| dc.subject | ion | en |
| dc.title | On the Nanostructure of Cu in TixCu1-x and TiN/Cu Films: a XAFS Study | en |
| heal.abstract | The effect of chemical composition on the bonding environment of Cu, in a series of Ti1-x Cu-x and TiN/Cu films, is studied using X-Ray Absorption Spectroscopies (XAFS) at the Cu-K-edge. The EXAFS analysis reveals that in all studied samples Cu is amorphous. However, its bonding environment depends on the chemical composition. More specifically, in the Ti1-xCux films, Cu is coordinated with Ti and Cu and belongs both to intermetallic TiCu and to an amorphous Cu matrix. The coordination number of Cu, i.e., the sum of Ti and Cu first neighbours, increases systematically from 6.3 +/- 0.7 to 10.6 +/- 0.9 when the Cu content increases from 24.1 to 52.7 at%. On the contrary, in the TiN/Cu films, the type of atoms that consists the 1(st) nearest neighbour shell of Cu varies as a function of the Cu concentration. More specifically, in the TiN/Cu film with the lowest Cu content (27.3 at%), intermetallic TiCu is detected. At intermediate Cu concentration (37.8 at%), Cu is bonded to both Ti and Cu atoms. Finally, in the TiN/Cu film with the highest Cu content (67.7 at%), Cu is metallic. | en |
| heal.access | campus | - |
| heal.fullTextAvailability | TRUE | - |
| heal.identifier.secondary | <Go to ISI>://000271239000006 | - |
| heal.journalName | Journal of Nano Research | en |
| heal.journalType | peer reviewed | - |
| heal.language | en | - |
| heal.publicationDate | 2009 | - |
| heal.publisher | Trans Tech Publications Ltd | en |
| heal.recordProvider | Πανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικών | el |
| heal.type | journalArticle | - |
| heal.type.el | Άρθρο Περιοδικού | el |
| heal.type.en | Journal article | en |
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