Numerical Simulation of Thermal Conductivity of Particle Filled Epoxy Composites

Απλή σελίδα τεκμηρίου
dc.contributor.authorZeng, J.en
dc.contributor.authorFu, R. L.en
dc.contributor.authorAgathopoulos, S.en
dc.contributor.authorZhang, S. D.en
dc.contributor.authorSong, X. F.en
dc.contributor.authorHe, H.en
dc.date.accessioned2015-11-24T17:36:42Z
dc.date.available2015-11-24T17:36:42Z
dc.identifier.issn1043-7398-
dc.identifier.urihttps://olympias.lib.uoi.gr/jspui/handle/123456789/14274
dc.rightsDefault Licence-
dc.subjectcomposite materialsen
dc.subjectthermal analysisen
dc.subjectencapsulanten
dc.subjectunderfillen
dc.subjectfinite element methoden
dc.subjectpolymer compositesen
dc.subjectptfe compositesen
dc.subjectmolding compoundsen
dc.subjectunderfillen
dc.subjectmixturesen
dc.subject2-phaseen
dc.subjectsolidsen
dc.titleNumerical Simulation of Thermal Conductivity of Particle Filled Epoxy Compositesen
heal.abstractA finite element method was developed to predict the effective thermal conductivity of particle filled epoxy composites. Three-dimensional models, which considered the effect of filler geometry, filler aspect ratio, conductivity ratio of filler to matrix, and interfacial layer were used to simulate the microstructure of epoxy composites for various filler volume fractions up to 30%. The calculated thermal conductivities were compared with results from existing theoretical models and experiments. Numerical estimation of ellipsoids-in-cube model accurately predicted thermal conductivity of epoxy composites with alumina filler particles. The number of length division during mesh process and particle numbers used in the finite element analysis affect the accuracy of calculated results. At a given value of filler content, the numerical results indicated a ratio of conductivity of filler to matrix for achieving the maximum thermal conductivity. [DOI: 10.1115/1.4000210]en
heal.accesscampus-
heal.fullTextAvailabilityTRUE-
heal.identifier.primaryDoi 10.1115/1.4000210-
heal.identifier.secondary<Go to ISI>://000271744500006-
heal.journalNameJournal of Electronic Packagingen
heal.journalTypepeer reviewed-
heal.languageen-
heal.publicationDate2009-
heal.recordProviderΠανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικώνel
heal.typejournalArticle-
heal.type.elΆρθρο Περιοδικούel
heal.type.enJournal articleen

Αρχεία

Φάκελος/Πακέτο αδειών

Προβολή: 1 - 1 of 1
Μικρογραφία εικόνας
Ονομα:
license.txt
Μέγεθος:
1.74 KB
Μορφότυπο:
Item-specific license agreed upon to submission
Περιγραφή:
Κατεβάστε

Συλλογές

Άρθρα σε επιστημονικά περιοδικά ( Ανοικτά)