Layer-by-layer UV micromachining methodology of epoxy resist embedded microchannels

dc.contributor.authorKitsara, M.en
dc.contributor.authorChatzichristidi, M.en
dc.contributor.authorNiakoula, D.en
dc.contributor.authorGoustouridis, D.en
dc.contributor.authorBeltsios, K.en
dc.contributor.authorArgitis, P.en
dc.contributor.authorRaptis, I.en
dc.date.accessioned2015-11-24T17:35:20Z
dc.date.available2015-11-24T17:35:20Z
dc.identifier.issn0167-9317-
dc.identifier.urihttps://olympias.lib.uoi.gr/jspui/handle/123456789/14113
dc.rightsDefault Licence-
dc.subjectembedded microchannelsen
dc.subjectepoxy resisten
dc.subjectuv lithographyen
dc.subjectmicro-channelsen
dc.subjectfabricationen
dc.titleLayer-by-layer UV micromachining methodology of epoxy resist embedded microchannelsen
heal.abstractA novel layer-by-layer fabrication approach for the manufacturing of long embedded microchannels is presented. The methodology is based on the use of two epoxy based photoresist layers with different photo acid generator (PAG) concentration. Using this methodology long, functional microchannels are demonstrated. The technology has been optimized through tuning of the epoxy molecular weight, PAG concentrations and processing conditions. Finally, a basic microfluidic application is presented. (c) 2006 Elsevier B.V. All rights reserved.en
heal.accesscampus-
heal.fullTextAvailabilityTRUE-
heal.identifier.primaryDOI 10.1016/j.mee.2006.01.157-
heal.identifier.secondary<Go to ISI>://000237581900162-
heal.identifier.secondaryhttp://ac.els-cdn.com/S0167931706001031/1-s2.0-S0167931706001031-main.pdf?_tid=29a5a8629e67ef735b7acbfc9ca2885c&acdnat=1339662561_8f52e068d74242340a2dd4a3162b2916-
heal.journalNameMicroelectronic Engineeringen
heal.journalTypepeer reviewed-
heal.languageen-
heal.publicationDate2006-
heal.publisherElsevieren
heal.recordProviderΠανεπιστήμιο Ιωαννίνων. Σχολή Θετικών Επιστημών. Τμήμα Μηχανικών Επιστήμης Υλικώνel
heal.typejournalArticle-
heal.type.elΆρθρο Περιοδικούel
heal.type.enJournal articleen

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