Germanium metal-insulator-semiconductor capacitors with rare earth La2O3 gate dielectric

dc.contributor.authorMavrou, G.en
dc.contributor.authorGalata, S. F.en
dc.contributor.authorSotiropoulos, A.en
dc.contributor.authorTsipas, P.en
dc.contributor.authorPanayiotatos, Y.en
dc.contributor.authorDimoulas, A.en
dc.contributor.authorEvangelou, E. K.en
dc.contributor.authorSeo, J. W.en
dc.contributor.authorDieker, C.en
dc.date.accessioned2015-11-24T18:27:43Z
dc.date.available2015-11-24T18:27:43Z
dc.identifier.issn0167-9317-
dc.identifier.urihttps://olympias.lib.uoi.gr/jspui/handle/123456789/16081
dc.rightsDefault Licence-
dc.subjectgermaniumen
dc.subjectpassivationen
dc.subjectrare earth oxidesen
dc.titleGermanium metal-insulator-semiconductor capacitors with rare earth La2O3 gate dielectricen
heal.abstractIn this work, we investigate La2O3 as a gate dielectric candidate for Ge devices, using metal-insulator-semiconductor (MIS) structures. When the deposition temperature increases, the electrical characteristics improve with regard to dispersion in accumulation, hysteresis, stretch out, leakage current and interface state density D-it. By analyzing the CV data for films with different oxide thickness we find that the dielectric constant of La2O3 has a medium k-value of about 11. The same data indicate that there is no interfacial layer, which is confirmed by high resolution transmission electron microscopy (HRTEM) observations. These results suggest that a strong reaction with the Ge substrate may take place so that a La-Ge-O compound may form over the entire film thickness reducing the k-value. This reaction layer could be responsible for the reduction of Dit indicating good passivating properties. However, it may limit gate oxide scaling in future Ge MOS devices.en
heal.accesscampus-
heal.fullTextAvailabilityTRUE-
heal.identifier.primaryDOI 10.1016/j.mee.2007.04.036-
heal.identifier.secondary<Go to ISI>://000247378600113-
heal.identifier.secondaryhttp://ac.els-cdn.com/S0167931707003863/1-s2.0-S0167931707003863-main.pdf?_tid=d8a1e9a4a4ed86d1596d11ad2eb4a750&acdnat=1334220010_35706e508c25e77768ddb7076bc6f680-
heal.journalNameMicroelectronic Engineeringen
heal.journalTypepeer reviewed-
heal.languageen-
heal.publicationDate2007-
heal.recordProviderΠανεπιστήμιο Ιωαννίνων. Σχολή Επιστημών και Τεχνολογιών. Τμήμα Βιολογικών Εφαρμογών και Τεχνολογιώνel
heal.typejournalArticle-
heal.type.elΆρθρο Περιοδικούel
heal.type.enJournal articleen

Αρχεία

Φάκελος/Πακέτο αδειών

Προβολή: 1 - 1 of 1
Φόρτωση...
Μικρογραφία εικόνας
Ονομα:
license.txt
Μέγεθος:
1.74 KB
Μορφότυπο:
Item-specific license agreed upon to submission
Περιγραφή: